Grain Refinement in Surficial Cryogenic Grinding

Gradient ultra-fine-grained microstructures of pure copper were obtained via surficial cryogenic grinding. The microhardness increased gradually from 110 to 158 HV, corresponding to the nondeformed matrix and the surficial materials, respectively. Elongated and equiaxed ultrafine grains were observe...

Full description

Saved in:
Bibliographic Details
Published in:Metallurgical and materials transactions. A, Physical metallurgy and materials science Physical metallurgy and materials science, 2020-07, Vol.51 (7), p.3349-3353
Main Authors: Liu, Yanchao, Huang, Yongxian, Guan, Meng, Meng, Xiangchen, Xie, Yuming
Format: Article
Language:English
Subjects:
Characterization and Evaluation of Materials
Chemistry and Materials Science
Communication
Cryogenic properties
Dynamic recrystallization
Grain refinement
Grinding
Materials Science
Metallic Materials
Microhardness
Nanotechnology
Plastic deformation
Structural Materials
Surfaces and Interfaces
Thin Films
Ultrafines
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:Gradient ultra-fine-grained microstructures of pure copper were obtained via surficial cryogenic grinding. The microhardness increased gradually from 110 to 158 HV, corresponding to the nondeformed matrix and the surficial materials, respectively. Elongated and equiaxed ultrafine grains were observed. The modes of grain refinement in the severe cryogenic plastic deformation were identified: split of the grains and dynamic recrystallization, corresponding to different strain rates, respectively.
ISSN:1073-5623
1543-1940
DOI:10.1007/s11661-020-05765-6