On the Evaporation of Colloidal Suspensions in Confined Pillar Arrays

The thermal and electrical transport capabilities of materials in electronic packaging are key to supporting high-performance microelectronic systems. In composite and hybrid materials, both of these transport capabilities are limited by contact resistances. We propose a directed nanoparticle assemb...

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Bibliographic Details
Published in:Transport in porous media 2018-11, Vol.125 (2), p.173-192
Main Authors: Zürcher, Jonas, Burg, Brian R., Del Carro, Luca, Studart, André R., Brunschwiler, Thomas
Format: Article
Language:English
Subjects:
Arrays
Assembly
Bond number
Civil Engineering
Classical and Continuum Physics
Colloids
Earth and Environmental Science
Earth Sciences
Electric bridges
Electric contacts
Electronic packaging
Geotechnical Engineering & Applied Earth Sciences
Hybrid systems
Hydrogeology
Hydrology/Water Resources
Industrial Chemistry/Chemical Engineering
Liquid bridges
Nanoparticles
Pore size
Porosity
Porous media
Product design
Surface tension
Transport
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Summary:The thermal and electrical transport capabilities of materials in electronic packaging are key to supporting high-performance microelectronic systems. In composite and hybrid materials, both of these transport capabilities are limited by contact resistances. We propose a directed nanoparticle assembly method to reduce contact resistances by transforming point contacts between micrometer-sized objects into quasi-areal contacts. The nanoparticle assembly is directed by the formation of liquid bridges in contact points during the evaporation of a colloidal suspension. In this work, we experimentally study the evaporation of colloidal suspensions in confined porous media to yield uniform nanoparticle assembly, as required for electronic packaging. The evaporation pattern of liquids in confined pillar arrays is either branched or straight, depending on the surface tension of the liquid and on the pore size defined by the pillar size and spacing. Stable evaporation fronts result in uniform nanoparticle deposition above a bond number threshold of 10 - 3 . However, at reduced evaporation dynamics, liquid pinning results from colloidal particle accumulations at the liquid–vapor interface, ultimately leading to undesired colloidal bridging between pillars.
ISSN:0169-3913
1573-1634
DOI:10.1007/s11242-018-1112-4