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Interface kinetics of combustion–diffusion bonding of Ni3Al/Ni and TiAl/Ti under direct current field

The bonding of TiB 2 –Ni and TiC–Ni composites to, respectively, Ni and Ti substrates was investigated by field-activated and pressure-assisted synthesis. Bonding and in situ synthesis was utilized to prepare (TiB 2 ) p Ni/Ni 3 Al/Ni (Composition 1) and (TiC) p Ni/TiAl/Ti (Composition 2) joining str...

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Bibliographic Details
Published in:Journal of materials science 2013-02, Vol.48 (3), p.1268-1274
Main Authors: Chen, S. P., Dong, F., Fan, W. H., Meng, Q. S., Munir, Zuhair A.
Format: Article
Language:English
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Summary:The bonding of TiB 2 –Ni and TiC–Ni composites to, respectively, Ni and Ti substrates was investigated by field-activated and pressure-assisted synthesis. Bonding and in situ synthesis was utilized to prepare (TiB 2 ) p Ni/Ni 3 Al/Ni (Composition 1) and (TiC) p Ni/TiAl/Ti (Composition 2) joining structures. The effect of applied current on the kinetics of formation of the diffusion layer between the substrate (Ni or Ti) and the respective intermetallic layer (Ni 3 Al or TiAl) was investigated. For both compositions, the current was shown to have a marked influence of the activation energy of formation of the layer, decreasing it by as much as 31 %. Calculations of adiabatic temperatures suggest a possible current contribution to interdiffusion, as has been reported previously.
ISSN:0022-2461
1573-4803
DOI:10.1007/s10853-012-6869-1