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Interface kinetics of combustion–diffusion bonding of Ni3Al/Ni and TiAl/Ti under direct current field
The bonding of TiB 2 –Ni and TiC–Ni composites to, respectively, Ni and Ti substrates was investigated by field-activated and pressure-assisted synthesis. Bonding and in situ synthesis was utilized to prepare (TiB 2 ) p Ni/Ni 3 Al/Ni (Composition 1) and (TiC) p Ni/TiAl/Ti (Composition 2) joining str...
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Published in: | Journal of materials science 2013-02, Vol.48 (3), p.1268-1274 |
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Main Authors: | , , , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
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Summary: | The bonding of TiB
2
–Ni and TiC–Ni composites to, respectively, Ni and Ti substrates was investigated by field-activated and pressure-assisted synthesis. Bonding and in situ synthesis was utilized to prepare (TiB
2
)
p
Ni/Ni
3
Al/Ni (Composition 1) and (TiC)
p
Ni/TiAl/Ti (Composition 2) joining structures. The effect of applied current on the kinetics of formation of the diffusion layer between the substrate (Ni or Ti) and the respective intermetallic layer (Ni
3
Al or TiAl) was investigated. For both compositions, the current was shown to have a marked influence of the activation energy of formation of the layer, decreasing it by as much as 31 %. Calculations of adiabatic temperatures suggest a possible current contribution to interdiffusion, as has been reported previously. |
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ISSN: | 0022-2461 1573-4803 |
DOI: | 10.1007/s10853-012-6869-1 |