Demonstration of RF and Microwave Passive Circuits Through 3-D Printing and Selective Metalization

The ultimate goal of this paper is to print radio frequency (RF) and microwave structures using a 3-D platform and to pattern metal films on nonplanar structures. To overcome substrate losses, air core substrates that can readily be printed are utilized. To meet the challenge of patterning conductiv...

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Bibliographic Details
Published in:IEEE transactions on components, packaging, and manufacturing technology (2011) packaging, and manufacturing technology (2011), 2017-03, Vol.7 (3), p.463-471
Main Authors: Byford, Jennifer A., Mohd Ghazali, Mohd Ifwat, Karuppuswami, Saranraj, Wright, Brian L., Chahal, Premjeet
Format: Article
Language:English
Subjects:
Additive manufacturing (AM)
air gap substrate
Air gaps
antennas
Bandpass filters
CAD
Cavity resonators
Circuit design
Computer aided design
Core loss
damascene
Design
Dielectric losses
Fabrication
Liftoff
Metal films
Microstrip transmission lines
Patch antennas
Patterning
Printing
Propagation losses
Radio frequency
radio frequency (RF) circuits
Resonators
Simulation
Substrates
Three dimensional printing
Transmission lines
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Summary:The ultimate goal of this paper is to print radio frequency (RF) and microwave structures using a 3-D platform and to pattern metal films on nonplanar structures. To overcome substrate losses, air core substrates that can readily be printed are utilized. To meet the challenge of patterning conductive layers on complex or nonplanar printed structures, two novel self-aligning patterning processes are demonstrated. One is a simple damascene-like process, and the other is a lift-off process using a 3-D printed lift-off mask layer. A range of microwave and RF circuits are designed and demonstrated between 1 and 8 GHz utilizing these processes. Designs are created and simulated using Keysight Advanced Design System and ANSYS High Frequency Structure Simulator. Circuit designs include a simple microstrip transmission line (T-line), coupled-line bandpass filter, circular ring resonator, T-line resonator, resonant cavity structure, and patch antenna. A commercially available 3-D printer and metal sputtering system are used to realize the designs. Both simulated and measured results of these structures are presented.
ISSN:2156-3950
2156-3985
DOI:10.1109/TCPMT.2017.2651645