Advanced electrically conductive adhesives for high complexity PCB assembly

Electronic packaging, or assembly of packed electronic components on printed circuit boards, present challenges that require innovative solder pastes and electrically conductive adhesives to face the increasing complexity of PCB assembly, with denser board occupation and demanding thermal management...

Full description

Saved in:
Bibliographic Details
Main Authors: Lopes, P. E., Moura, D., Freitas, D., Proença, M.F., Figueiredo, H., Alves, R., Paiva, M. C.
Format: Conference Proceeding
Language:English
Subjects:
Adhesives
Assembly
Circuit boards
Complexity
Electrical resistivity
Electronic components
Electronic packaging
Epoxy resins
Pastes
Percolation
Polymer matrix composites
Printed circuits
Product development
Thermal management
Citations: Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:Electronic packaging, or assembly of packed electronic components on printed circuit boards, present challenges that require innovative solder pastes and electrically conductive adhesives to face the increasing complexity of PCB assembly, with denser board occupation and demanding thermal management during assembly. Our aim is to prepare carbon particle based conductive adhesives. The first step to achieve this goal was to prepare composites with epoxy resin and a variety of nano to micron scale carbon particle, produced by mixing on a three roll mill. The percolation threshold for each particle type was determined as well as the conductivity level reached after percolation.
ISSN:0094-243X
1551-7616
DOI:10.1063/1.5084887