Loading…
Measurement of copper deposition by electrocoagulation/flotation from waste printing developer
[Display omitted] •Electrocoagulation/flotation (ECF) treatment of the printing effluent was applied.•The combinations of electrodes of dissimilar metals were used.•The copper (Cu) was successfully removed (95.5%) with aluminum electrodes.•Response surface methodology was used for ECF treatment opti...
Saved in:
| Published in: | Measurement : journal of the International Measurement Confederation 2019-01, Vol.131, p.288-299 |
|---|---|
| Main Authors: | , , , , , , |
| Format: | Article |
| Language: | English |
| Subjects: | |
| Citations: | Items that this one cites Items that cite this one |
| Online Access: | Get full text |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| cited_by | cdi_FETCH-LOGICAL-c407t-49a9a9740d1b28f7ab4cc47085d5e99289fc9d51cc9af89960ea8198f6a3c8b33 |
|---|---|
| cites | cdi_FETCH-LOGICAL-c407t-49a9a9740d1b28f7ab4cc47085d5e99289fc9d51cc9af89960ea8198f6a3c8b33 |
| container_end_page | 299 |
| container_issue | |
| container_start_page | 288 |
| container_title | Measurement : journal of the International Measurement Confederation |
| container_volume | 131 |
| creator | Adamović, Savka Prica, Miljana Dalmacija, Božo Kragulj Isakovski, Marijana Kerkez, Đurđa Rapajić, Sanja Adamović, Dragan |
| description | [Display omitted]
•Electrocoagulation/flotation (ECF) treatment of the printing effluent was applied.•The combinations of electrodes of dissimilar metals were used.•The copper (Cu) was successfully removed (95.5%) with aluminum electrodes.•Response surface methodology was used for ECF treatment optimization.•Solidification/stabilization treatment efficiently immobilized Cu in waste sludge.
The electrocoagulation/flotation treatment (ECF) was employed for the reduction of copper from the waste printing developer in a batch study by using four different aluminum and iron electrode combinations with independent ECF parameters such as current density, interelectrode distance and operating time. The individual and interactive effects of the three main independent ECF parameters were studied by using the response surface methodology. Based on the results, parameters for high copper removal efficiency (95.5%) from the waste printing developer by the ECF were: Al(−)/Al(+) electrode combination with an interelectrode distance of 1.0 cm, operating time of 10 min and a current density of 4 mA cm−2. Moreover, the kinetic study of the ECF treatment of waste printing developer demonstrated that the removal of copper follows the pseudo second-order model with current dependent parameters. For immobilization process of copper in waste ECF sludge, the solidification/stabilization (S/S) treatment was conducted with Portland cement, lime, bentonite, and local clay as immobilization agents. The efficiency of the S/S treatment was monitored by applying leaching tests with one extraction fluid during a certain time. Therefore, using ECF and S/S treatments, copper from the printing effluent can be safely disposed into the environment. |
| doi_str_mv | 10.1016/j.measurement.2018.08.077 |
| format | article |
| fullrecord | <record><control><sourceid>proquest_cross</sourceid><recordid>TN_cdi_proquest_journals_2131833741</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><els_id>S0263224118308212</els_id><sourcerecordid>2131833741</sourcerecordid><originalsourceid>FETCH-LOGICAL-c407t-49a9a9740d1b28f7ab4cc47085d5e99289fc9d51cc9af89960ea8198f6a3c8b33</originalsourceid><addsrcrecordid>eNqNUE1LxDAQDaLguvofKp67m49ukxxl8QtWvCh4MqTpZGlpm5qkK_57s66gR5kHMwzz3sw8hC4JXhBMymW76EGHyUMPQ1xQTMQCJ3B-hGZEcJYXhL4eoxmmJcspLcgpOguhxRiXTJYz9Pb4S8-czYwbR_BZDaMLTWzckFWfGXRgonfG6e3U6X13aTsXv6vMetdnHzpEyEbfDLEZtom-g84loXN0YnUX4OInz9HL7c3z-j7fPN09rK83uSkwj3khdQpe4JpUVFiuq8KYgmOxqlcgJRXSGlmviDFSWyFliUELIoUtNTOiYmyOrg66o3fvE4SoWjf5Ia1UlDAiGOMFSVPyMGW8C8GDVeniXvtPRbDa26la9cdOtbdT4QTOE3d94EJ6Y9eAV8E0MBioG5_cUbVr_qHyBSyih00</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>2131833741</pqid></control><display><type>article</type><title>Measurement of copper deposition by electrocoagulation/flotation from waste printing developer</title><source>Elsevier</source><creator>Adamović, Savka ; Prica, Miljana ; Dalmacija, Božo ; Kragulj Isakovski, Marijana ; Kerkez, Đurđa ; Rapajić, Sanja ; Adamović, Dragan</creator><creatorcontrib>Adamović, Savka ; Prica, Miljana ; Dalmacija, Božo ; Kragulj Isakovski, Marijana ; Kerkez, Đurđa ; Rapajić, Sanja ; Adamović, Dragan</creatorcontrib><description>[Display omitted]
•Electrocoagulation/flotation (ECF) treatment of the printing effluent was applied.•The combinations of electrodes of dissimilar metals were used.•The copper (Cu) was successfully removed (95.5%) with aluminum electrodes.•Response surface methodology was used for ECF treatment optimization.•Solidification/stabilization treatment efficiently immobilized Cu in waste sludge.
The electrocoagulation/flotation treatment (ECF) was employed for the reduction of copper from the waste printing developer in a batch study by using four different aluminum and iron electrode combinations with independent ECF parameters such as current density, interelectrode distance and operating time. The individual and interactive effects of the three main independent ECF parameters were studied by using the response surface methodology. Based on the results, parameters for high copper removal efficiency (95.5%) from the waste printing developer by the ECF were: Al(−)/Al(+) electrode combination with an interelectrode distance of 1.0 cm, operating time of 10 min and a current density of 4 mA cm−2. Moreover, the kinetic study of the ECF treatment of waste printing developer demonstrated that the removal of copper follows the pseudo second-order model with current dependent parameters. For immobilization process of copper in waste ECF sludge, the solidification/stabilization (S/S) treatment was conducted with Portland cement, lime, bentonite, and local clay as immobilization agents. The efficiency of the S/S treatment was monitored by applying leaching tests with one extraction fluid during a certain time. Therefore, using ECF and S/S treatments, copper from the printing effluent can be safely disposed into the environment.</description><identifier>ISSN: 0263-2241</identifier><identifier>EISSN: 1873-412X</identifier><identifier>DOI: 10.1016/j.measurement.2018.08.077</identifier><language>eng</language><publisher>London: Elsevier Ltd</publisher><subject>Aluminum ; Bentonite ; Copper ; Current density ; Electrocoagulation ; Electrocoagulation/flotation ; Electrodes ; Flotation ; Immobilization ; Leaching ; Measurement ; Portland cements ; Printing ; Process parameters ; Response surface methodology ; Sludge ; Solidification ; Solidification/stabilization ; Surface chemistry ; Waste disposal ; Waste printing developer ; Water treatment</subject><ispartof>Measurement : journal of the International Measurement Confederation, 2019-01, Vol.131, p.288-299</ispartof><rights>2018 Elsevier Ltd</rights><rights>Copyright Elsevier Science Ltd. Jan 2019</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c407t-49a9a9740d1b28f7ab4cc47085d5e99289fc9d51cc9af89960ea8198f6a3c8b33</citedby><cites>FETCH-LOGICAL-c407t-49a9a9740d1b28f7ab4cc47085d5e99289fc9d51cc9af89960ea8198f6a3c8b33</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>315,786,790,27957,27958</link.rule.ids></links><search><creatorcontrib>Adamović, Savka</creatorcontrib><creatorcontrib>Prica, Miljana</creatorcontrib><creatorcontrib>Dalmacija, Božo</creatorcontrib><creatorcontrib>Kragulj Isakovski, Marijana</creatorcontrib><creatorcontrib>Kerkez, Đurđa</creatorcontrib><creatorcontrib>Rapajić, Sanja</creatorcontrib><creatorcontrib>Adamović, Dragan</creatorcontrib><title>Measurement of copper deposition by electrocoagulation/flotation from waste printing developer</title><title>Measurement : journal of the International Measurement Confederation</title><description>[Display omitted]
•Electrocoagulation/flotation (ECF) treatment of the printing effluent was applied.•The combinations of electrodes of dissimilar metals were used.•The copper (Cu) was successfully removed (95.5%) with aluminum electrodes.•Response surface methodology was used for ECF treatment optimization.•Solidification/stabilization treatment efficiently immobilized Cu in waste sludge.
The electrocoagulation/flotation treatment (ECF) was employed for the reduction of copper from the waste printing developer in a batch study by using four different aluminum and iron electrode combinations with independent ECF parameters such as current density, interelectrode distance and operating time. The individual and interactive effects of the three main independent ECF parameters were studied by using the response surface methodology. Based on the results, parameters for high copper removal efficiency (95.5%) from the waste printing developer by the ECF were: Al(−)/Al(+) electrode combination with an interelectrode distance of 1.0 cm, operating time of 10 min and a current density of 4 mA cm−2. Moreover, the kinetic study of the ECF treatment of waste printing developer demonstrated that the removal of copper follows the pseudo second-order model with current dependent parameters. For immobilization process of copper in waste ECF sludge, the solidification/stabilization (S/S) treatment was conducted with Portland cement, lime, bentonite, and local clay as immobilization agents. The efficiency of the S/S treatment was monitored by applying leaching tests with one extraction fluid during a certain time. Therefore, using ECF and S/S treatments, copper from the printing effluent can be safely disposed into the environment.</description><subject>Aluminum</subject><subject>Bentonite</subject><subject>Copper</subject><subject>Current density</subject><subject>Electrocoagulation</subject><subject>Electrocoagulation/flotation</subject><subject>Electrodes</subject><subject>Flotation</subject><subject>Immobilization</subject><subject>Leaching</subject><subject>Measurement</subject><subject>Portland cements</subject><subject>Printing</subject><subject>Process parameters</subject><subject>Response surface methodology</subject><subject>Sludge</subject><subject>Solidification</subject><subject>Solidification/stabilization</subject><subject>Surface chemistry</subject><subject>Waste disposal</subject><subject>Waste printing developer</subject><subject>Water treatment</subject><issn>0263-2241</issn><issn>1873-412X</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2019</creationdate><recordtype>article</recordtype><recordid>eNqNUE1LxDAQDaLguvofKp67m49ukxxl8QtWvCh4MqTpZGlpm5qkK_57s66gR5kHMwzz3sw8hC4JXhBMymW76EGHyUMPQ1xQTMQCJ3B-hGZEcJYXhL4eoxmmJcspLcgpOguhxRiXTJYz9Pb4S8-czYwbR_BZDaMLTWzckFWfGXRgonfG6e3U6X13aTsXv6vMetdnHzpEyEbfDLEZtom-g84loXN0YnUX4OInz9HL7c3z-j7fPN09rK83uSkwj3khdQpe4JpUVFiuq8KYgmOxqlcgJRXSGlmviDFSWyFliUELIoUtNTOiYmyOrg66o3fvE4SoWjf5Ia1UlDAiGOMFSVPyMGW8C8GDVeniXvtPRbDa26la9cdOtbdT4QTOE3d94EJ6Y9eAV8E0MBioG5_cUbVr_qHyBSyih00</recordid><startdate>201901</startdate><enddate>201901</enddate><creator>Adamović, Savka</creator><creator>Prica, Miljana</creator><creator>Dalmacija, Božo</creator><creator>Kragulj Isakovski, Marijana</creator><creator>Kerkez, Đurđa</creator><creator>Rapajić, Sanja</creator><creator>Adamović, Dragan</creator><general>Elsevier Ltd</general><general>Elsevier Science Ltd</general><scope>AAYXX</scope><scope>CITATION</scope></search><sort><creationdate>201901</creationdate><title>Measurement of copper deposition by electrocoagulation/flotation from waste printing developer</title><author>Adamović, Savka ; Prica, Miljana ; Dalmacija, Božo ; Kragulj Isakovski, Marijana ; Kerkez, Đurđa ; Rapajić, Sanja ; Adamović, Dragan</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c407t-49a9a9740d1b28f7ab4cc47085d5e99289fc9d51cc9af89960ea8198f6a3c8b33</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2019</creationdate><topic>Aluminum</topic><topic>Bentonite</topic><topic>Copper</topic><topic>Current density</topic><topic>Electrocoagulation</topic><topic>Electrocoagulation/flotation</topic><topic>Electrodes</topic><topic>Flotation</topic><topic>Immobilization</topic><topic>Leaching</topic><topic>Measurement</topic><topic>Portland cements</topic><topic>Printing</topic><topic>Process parameters</topic><topic>Response surface methodology</topic><topic>Sludge</topic><topic>Solidification</topic><topic>Solidification/stabilization</topic><topic>Surface chemistry</topic><topic>Waste disposal</topic><topic>Waste printing developer</topic><topic>Water treatment</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Adamović, Savka</creatorcontrib><creatorcontrib>Prica, Miljana</creatorcontrib><creatorcontrib>Dalmacija, Božo</creatorcontrib><creatorcontrib>Kragulj Isakovski, Marijana</creatorcontrib><creatorcontrib>Kerkez, Đurđa</creatorcontrib><creatorcontrib>Rapajić, Sanja</creatorcontrib><creatorcontrib>Adamović, Dragan</creatorcontrib><collection>CrossRef</collection><jtitle>Measurement : journal of the International Measurement Confederation</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Adamović, Savka</au><au>Prica, Miljana</au><au>Dalmacija, Božo</au><au>Kragulj Isakovski, Marijana</au><au>Kerkez, Đurđa</au><au>Rapajić, Sanja</au><au>Adamović, Dragan</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Measurement of copper deposition by electrocoagulation/flotation from waste printing developer</atitle><jtitle>Measurement : journal of the International Measurement Confederation</jtitle><date>2019-01</date><risdate>2019</risdate><volume>131</volume><spage>288</spage><epage>299</epage><pages>288-299</pages><issn>0263-2241</issn><eissn>1873-412X</eissn><abstract>[Display omitted]
•Electrocoagulation/flotation (ECF) treatment of the printing effluent was applied.•The combinations of electrodes of dissimilar metals were used.•The copper (Cu) was successfully removed (95.5%) with aluminum electrodes.•Response surface methodology was used for ECF treatment optimization.•Solidification/stabilization treatment efficiently immobilized Cu in waste sludge.
The electrocoagulation/flotation treatment (ECF) was employed for the reduction of copper from the waste printing developer in a batch study by using four different aluminum and iron electrode combinations with independent ECF parameters such as current density, interelectrode distance and operating time. The individual and interactive effects of the three main independent ECF parameters were studied by using the response surface methodology. Based on the results, parameters for high copper removal efficiency (95.5%) from the waste printing developer by the ECF were: Al(−)/Al(+) electrode combination with an interelectrode distance of 1.0 cm, operating time of 10 min and a current density of 4 mA cm−2. Moreover, the kinetic study of the ECF treatment of waste printing developer demonstrated that the removal of copper follows the pseudo second-order model with current dependent parameters. For immobilization process of copper in waste ECF sludge, the solidification/stabilization (S/S) treatment was conducted with Portland cement, lime, bentonite, and local clay as immobilization agents. The efficiency of the S/S treatment was monitored by applying leaching tests with one extraction fluid during a certain time. Therefore, using ECF and S/S treatments, copper from the printing effluent can be safely disposed into the environment.</abstract><cop>London</cop><pub>Elsevier Ltd</pub><doi>10.1016/j.measurement.2018.08.077</doi><tpages>12</tpages></addata></record> |
| fulltext | fulltext |
| identifier | ISSN: 0263-2241 |
| ispartof | Measurement : journal of the International Measurement Confederation, 2019-01, Vol.131, p.288-299 |
| issn | 0263-2241 1873-412X |
| language | eng |
| recordid | cdi_proquest_journals_2131833741 |
| source | Elsevier |
| subjects | Aluminum Bentonite Copper Current density Electrocoagulation Electrocoagulation/flotation Electrodes Flotation Immobilization Leaching Measurement Portland cements Printing Process parameters Response surface methodology Sludge Solidification Solidification/stabilization Surface chemistry Waste disposal Waste printing developer Water treatment |
| title | Measurement of copper deposition by electrocoagulation/flotation from waste printing developer |
| url | http://sfxeu10.hosted.exlibrisgroup.com/loughborough?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-09-21T12%3A52%3A37IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_cross&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Measurement%20of%20copper%20deposition%20by%20electrocoagulation/flotation%20from%20waste%20printing%20developer&rft.jtitle=Measurement%20:%20journal%20of%20the%20International%20Measurement%20Confederation&rft.au=Adamovi%C4%87,%20Savka&rft.date=2019-01&rft.volume=131&rft.spage=288&rft.epage=299&rft.pages=288-299&rft.issn=0263-2241&rft.eissn=1873-412X&rft_id=info:doi/10.1016/j.measurement.2018.08.077&rft_dat=%3Cproquest_cross%3E2131833741%3C/proquest_cross%3E%3Cgrp_id%3Ecdi_FETCH-LOGICAL-c407t-49a9a9740d1b28f7ab4cc47085d5e99289fc9d51cc9af89960ea8198f6a3c8b33%3C/grp_id%3E%3Coa%3E%3C/oa%3E%3Curl%3E%3C/url%3E&rft_id=info:oai/&rft_pqid=2131833741&rft_id=info:pmid/&rfr_iscdi=true |