Measurement of copper deposition by electrocoagulation/flotation from waste printing developer

[Display omitted] •Electrocoagulation/flotation (ECF) treatment of the printing effluent was applied.•The combinations of electrodes of dissimilar metals were used.•The copper (Cu) was successfully removed (95.5%) with aluminum electrodes.•Response surface methodology was used for ECF treatment opti...

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Bibliographic Details
Published in:Measurement : journal of the International Measurement Confederation 2019-01, Vol.131, p.288-299
Main Authors: Adamović, Savka, Prica, Miljana, Dalmacija, Božo, Kragulj Isakovski, Marijana, Kerkez, Đurđa, Rapajić, Sanja, Adamović, Dragan
Format: Article
Language:English
Subjects:
Aluminum
Bentonite
Copper
Current density
Electrocoagulation
Electrocoagulation/flotation
Electrodes
Flotation
Immobilization
Leaching
Measurement
Portland cements
Printing
Process parameters
Response surface methodology
Sludge
Solidification
Solidification/stabilization
Surface chemistry
Waste disposal
Waste printing developer
Water treatment
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Summary:[Display omitted] •Electrocoagulation/flotation (ECF) treatment of the printing effluent was applied.•The combinations of electrodes of dissimilar metals were used.•The copper (Cu) was successfully removed (95.5%) with aluminum electrodes.•Response surface methodology was used for ECF treatment optimization.•Solidification/stabilization treatment efficiently immobilized Cu in waste sludge. The electrocoagulation/flotation treatment (ECF) was employed for the reduction of copper from the waste printing developer in a batch study by using four different aluminum and iron electrode combinations with independent ECF parameters such as current density, interelectrode distance and operating time. The individual and interactive effects of the three main independent ECF parameters were studied by using the response surface methodology. Based on the results, parameters for high copper removal efficiency (95.5%) from the waste printing developer by the ECF were: Al(−)/Al(+) electrode combination with an interelectrode distance of 1.0 cm, operating time of 10 min and a current density of 4 mA cm−2. Moreover, the kinetic study of the ECF treatment of waste printing developer demonstrated that the removal of copper follows the pseudo second-order model with current dependent parameters. For immobilization process of copper in waste ECF sludge, the solidification/stabilization (S/S) treatment was conducted with Portland cement, lime, bentonite, and local clay as immobilization agents. The efficiency of the S/S treatment was monitored by applying leaching tests with one extraction fluid during a certain time. Therefore, using ECF and S/S treatments, copper from the printing effluent can be safely disposed into the environment.
ISSN:0263-2241
1873-412X
DOI:10.1016/j.measurement.2018.08.077