Experimental investigation of Ge-doped Bi-11Ag as a new Pb-free solder alloy for power die attachment

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Bibliographic Details
Published in:Journal of electronic materials 2002-11, Vol.31 (11), p.1244
Main Authors: Lalena, John N, Dean, Nancy F, Weiser, Martin W
Format: Article
Language:English
Online Access:Get full text
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ISSN:0361-5235
1543-186X
DOI:10.1007/s11664-002-0016-8