Intrinsic high-barrier polyimide with low free volume derived from a novel diamine monomer containing rigid planar moiety

An intrinsic high-barrier and thermally stable polyimide (2,7-CPPI) was prepared by the polymerization of pyromellitic dianhydride (PMDA) and novel diamine (2,7-CPDA), which consists of rigid planar carbazole moiety. The resulted 2,7-CPPI exhibits excellent barrier properties, with oxygen transmissi...

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Bibliographic Details
Published in:Polymer (Guilford) 2017-04, Vol.114, p.289-297
Main Authors: Liu, Yiwu, Huang, Jie, Tan, JingHua, Zeng, Yi, Liu, JunJie, Zhang, Hailiang, Pei, Yong, Xiang, XianWei, Liu, YueJun
Format: Article
Language:English
Subjects:
Barrier properties
Barriers
Bonding strength
Carbazole
Chemical bonds
Dynamic mechanical properties
Free volume
Glass transition temperature
Hydrogen bonding
Hydrogen bonds
Mechanical properties
Molecular chains
Molecular dynamics
Molecular structure
Organic light emitting diodes
Packaging
Polyimide
Polymerization
Positron annihilation
Rigid planar moiety
Rigidity
Spectroscopy
Spectrum analysis
Studies
Substrates
Temperature
Thermal expansion
Thermal stability
Water vapor
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Summary:An intrinsic high-barrier and thermally stable polyimide (2,7-CPPI) was prepared by the polymerization of pyromellitic dianhydride (PMDA) and novel diamine (2,7-CPDA), which consists of rigid planar carbazole moiety. The resulted 2,7-CPPI exhibits excellent barrier properties, with oxygen transmission rate and water vapor transmission rate low to 0.2 cm3 m−2·day−1 and 0.1 g m−2·day−1, respectively. Wide angle X-ray diffractograms (WAXD), positron annihilation lifetime spectroscopy (PALS) and molecular dynamics simulations reveal that the excellent barrier properties of 2,7-CPPI are mainly ascribed to the crystallinity, high chain rigidity and low free volume, which are resulted from the rigid planar structure and strong hydrogen bonding among molecular chains. Meanwhile, 2,7-CPPI also presents outstanding thermal stability and mechanical properties with a glass transition temperature of 437 °C, 5 wt % loss temperature of 556 °C under N2, coefficient of thermal expansion of 2.89 ppm/K and tensile strength of 143.8 MPa. The polyimide shows attractive potential applications in flexible electronics and high-grade packaging area, especially using as the substrates for top-emitting OLEDs display. [Display omitted] •A novel diamine containing rigid planar carbazole moiety was successfully prepared.•An intrinsic high-barrier and thermally stable polyimide was reported.•Introducing of rigid planar moiety can improve the barrier properties of polyimides.
ISSN:0032-3861
1873-2291
DOI:10.1016/j.polymer.2017.03.006