Fabrication and Characterization of Electrical Interconnects and Microfluidic Cooling for 3D ICS With Silicon Interposer

Heat generation in high-performance three-dimensional integrated circuits (3D ICs) is a significant challenge due to limited heat removal paths and high power density. To address this challenge, this paper presents an embedded microfluidic heat sink (MFHS) for such high-performance 3D ICs. In the pr...

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Bibliographic Details
Published in:Heat transfer engineering 2016-07, Vol.37 (11), p.903-911
Main Authors: Oh, Hanju, Zhang, Yue, Zheng, Li, May, Gary S., Bakir, Muhannad S.
Format: Article
Language:English
Subjects:
Cooling
Electrical properties
Engineering
Fluidics
Heat generation
Heat transfer
Integrated circuits
Interconnections
Microfluidics
Three dimensional
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Summary:Heat generation in high-performance three-dimensional integrated circuits (3D ICs) is a significant challenge due to limited heat removal paths and high power density. To address this challenge, this paper presents an embedded microfluidic heat sink (MFHS) for such high-performance 3D ICs. In the proposed 3D IC system, each tier contains an embedded MFHS, along with high-aspect-ratio (23:1) through-silicon vias (TSVs) routed through the MFHS. In each tier, solder-based electrical and fluidic inputs/outputs are co-fabricated with wafer-level batch fabrication. Moreover, microfluidic cooling experiments of staggered micropin-fins with embedded TSVs are presented for the first time.
ISSN:0145-7632
1521-0537
DOI:10.1080/01457632.2015.1097753