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Highly selective reactive ion etching applied to the fabrication of low-noise AlGaAs GaAs FET's
Selective dry etching of GaAs to AlGaAs (x = 0.25) using pure CCl 2 F 2 etching gas has been achieved. During reactive ion etching (RIE), the discharge has been analyzed by optical emission and mass spectroscopy. A high-selectivity ratio up to 1000, associated with a clean and anisotropic etching or...
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Published in: | IEEE transactions on electron devices 1986-07, Vol.33 (7), p.934-937 |
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container_end_page | 937 |
container_issue | 7 |
container_start_page | 934 |
container_title | IEEE transactions on electron devices |
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creator | Vatus, J. Chevrier, J. Delescluse, P. Rochette, J.-F. |
description | Selective dry etching of GaAs to AlGaAs (x = 0.25) using pure CCl 2 F 2 etching gas has been achieved. During reactive ion etching (RIE), the discharge has been analyzed by optical emission and mass spectroscopy. A high-selectivity ratio up to 1000, associated with a clean and anisotropic etching or an undercut of GaAs can be obtained by adjustment of the pressure. Selective RIE has been used to etch the n + GaAs cap layer of an n + GaAs/AlGaAs/GaAs heterostructure and to define the gate recess of discrete two-dimensional electron-gas FET's (TEGFET's). Results on low-noise TEGFET's fabricated by this technique are reported for the first time. Thanks to the reduction of side etching, very low source resistances have been obtained (less than 1 Ω . mm) for a source-to-gate distance up to 2 µm. Noise figures of 2 dB have been measured at 12 GHz with an associated gain of 8.3 dB for a gate length of 0.7 µm. |
doi_str_mv | 10.1109/T-ED.1986.22598 |
format | article |
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During reactive ion etching (RIE), the discharge has been analyzed by optical emission and mass spectroscopy. A high-selectivity ratio up to 1000, associated with a clean and anisotropic etching or an undercut of GaAs can be obtained by adjustment of the pressure. Selective RIE has been used to etch the n + GaAs cap layer of an n + GaAs/AlGaAs/GaAs heterostructure and to define the gate recess of discrete two-dimensional electron-gas FET's (TEGFET's). Results on low-noise TEGFET's fabricated by this technique are reported for the first time. Thanks to the reduction of side etching, very low source resistances have been obtained (less than 1 Ω . mm) for a source-to-gate distance up to 2 µm. Noise figures of 2 dB have been measured at 12 GHz with an associated gain of 8.3 dB for a gate length of 0.7 µm.</description><identifier>ISSN: 0018-9383</identifier><identifier>EISSN: 1557-9646</identifier><identifier>DOI: 10.1109/T-ED.1986.22598</identifier><identifier>CODEN: IETDAI</identifier><language>eng</language><publisher>New York, NY: IEEE</publisher><subject>Applied sciences ; Electronics ; Exact sciences and technology ; Microelectronic fabrication (materials and surfaces technology) ; Semiconductor electronics. Microelectronics. Optoelectronics. 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During reactive ion etching (RIE), the discharge has been analyzed by optical emission and mass spectroscopy. A high-selectivity ratio up to 1000, associated with a clean and anisotropic etching or an undercut of GaAs can be obtained by adjustment of the pressure. Selective RIE has been used to etch the n + GaAs cap layer of an n + GaAs/AlGaAs/GaAs heterostructure and to define the gate recess of discrete two-dimensional electron-gas FET's (TEGFET's). Results on low-noise TEGFET's fabricated by this technique are reported for the first time. Thanks to the reduction of side etching, very low source resistances have been obtained (less than 1 Ω . mm) for a source-to-gate distance up to 2 µm. Noise figures of 2 dB have been measured at 12 GHz with an associated gain of 8.3 dB for a gate length of 0.7 µm.</description><subject>Applied sciences</subject><subject>Electronics</subject><subject>Exact sciences and technology</subject><subject>Microelectronic fabrication (materials and surfaces technology)</subject><subject>Semiconductor electronics. Microelectronics. Optoelectronics. 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Microelectronics. Optoelectronics. Solid state devices</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Vatus, J.</creatorcontrib><creatorcontrib>Chevrier, J.</creatorcontrib><creatorcontrib>Delescluse, P.</creatorcontrib><creatorcontrib>Rochette, J.-F.</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Technology Research Database</collection><collection>Aerospace Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>IEEE transactions on electron devices</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Vatus, J.</au><au>Chevrier, J.</au><au>Delescluse, P.</au><au>Rochette, J.-F.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Highly selective reactive ion etching applied to the fabrication of low-noise AlGaAs GaAs FET's</atitle><jtitle>IEEE transactions on electron devices</jtitle><stitle>TED</stitle><date>1986-07-01</date><risdate>1986</risdate><volume>33</volume><issue>7</issue><spage>934</spage><epage>937</epage><pages>934-937</pages><issn>0018-9383</issn><eissn>1557-9646</eissn><coden>IETDAI</coden><notes>ObjectType-Article-2</notes><notes>SourceType-Scholarly Journals-1</notes><notes>ObjectType-Feature-1</notes><notes>content type line 23</notes><abstract>Selective dry etching of GaAs to AlGaAs (x = 0.25) using pure CCl 2 F 2 etching gas has been achieved. During reactive ion etching (RIE), the discharge has been analyzed by optical emission and mass spectroscopy. A high-selectivity ratio up to 1000, associated with a clean and anisotropic etching or an undercut of GaAs can be obtained by adjustment of the pressure. Selective RIE has been used to etch the n + GaAs cap layer of an n + GaAs/AlGaAs/GaAs heterostructure and to define the gate recess of discrete two-dimensional electron-gas FET's (TEGFET's). Results on low-noise TEGFET's fabricated by this technique are reported for the first time. Thanks to the reduction of side etching, very low source resistances have been obtained (less than 1 Ω . mm) for a source-to-gate distance up to 2 µm. Noise figures of 2 dB have been measured at 12 GHz with an associated gain of 8.3 dB for a gate length of 0.7 µm.</abstract><cop>New York, NY</cop><pub>IEEE</pub><doi>10.1109/T-ED.1986.22598</doi><tpages>4</tpages></addata></record> |
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source | IEEE Electronic Library (IEL) Journals |
subjects | Applied sciences Electronics Exact sciences and technology Microelectronic fabrication (materials and surfaces technology) Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices |
title | Highly selective reactive ion etching applied to the fabrication of low-noise AlGaAs GaAs FET's |
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