In situ observation of twin boundary migration in copper with nanoscale twins during tensile deformation

In situ transmission electron microscopy observations are reported of the dynamic process of twin boundary migration in Cu with nanoscale twins. The experiment provides the first direct evidence of twin boundary migration via Shockley partial dislocation emission from the twin boundary/grain boundar...

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Bibliographic Details
Published in:Philosophical magazine letters 2007-12, Vol.87 (12), p.935-942
Main Authors: Wang, Y. B., Sui, M. L., Ma, E.
Format: Article
Language:English
Subjects:
Condensed matter: structure, mechanical and thermal properties
Defects and impurities in crystals
microstructure
Deformation and plasticity (including yield, ductility, and superplasticity)
Direct observation of dislocations and other defects (etch pits, decoration, electron microscopy, x-ray topography, etc.)
Exact sciences and technology
Grain and twin boundaries
Mechanical and acoustical properties of condensed matter
Mechanical properties of solids
Physics
Structure of solids and liquids
crystallography
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Summary:In situ transmission electron microscopy observations are reported of the dynamic process of twin boundary migration in Cu with nanoscale twins. The experiment provides the first direct evidence of twin boundary migration via Shockley partial dislocation emission from the twin boundary/grain boundary intersections, and reveals that such migration is the dominant deformation mechanism in the initial stage of plastic straining. The behaviour is discussed in comparison with molecular dynamics simulations and in terms of the unique characteristics of the sample microstructure.
ISSN:0950-0839
1362-3036
DOI:10.1080/09500830701591493