Fully integrated AC coupled interconnect using buried bumps : The elctrical of packages and interconnects

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Bibliographic Details
Published in:IEEE transactions on advanced packaging 2007, Vol.30 (2), p.191-199
Main Authors: WILSON, John, MICK, Stephen, JIAN XU, LEI LUO, BONAFEDE, Salvatore, HUFFMAN, Alan, LABENNETT, Richard, FRANZON, Paul D
Format: Article
Language:English
Subjects:
Applied sciences
Design. Technologies. Operation analysis. Testing
Dielectric, amorphous and glass solid devices
Electronic equipment and fabrication. Passive components, printed wiring boards, connectics
Electronics
Exact sciences and technology
Integrated circuits
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Online Access:Get full text
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ISSN:1521-3323
1557-9980