SU-8: a photoresist for high-aspect-ratio and 3D submicron lithography

SU-8 has become the favourite photoresist for high-aspect-ratio (HAR) and three-dimensional (3D) lithographic patterning due to its excellent coating, planarization and processing properties as well as its mechanical and chemical stability. However, as feature sizes get smaller and pattern complexit...

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Bibliographic Details
Published in:Journal of micromechanics and microengineering 2007-06, Vol.17 (6), p.R81-R95
Main Authors: del Campo, A, Greiner, C
Format: Article
Language:English
Subjects:
Applied sciences
Electronics
Exact sciences and technology
Microelectronic fabrication (materials and surfaces technology)
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
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Summary:SU-8 has become the favourite photoresist for high-aspect-ratio (HAR) and three-dimensional (3D) lithographic patterning due to its excellent coating, planarization and processing properties as well as its mechanical and chemical stability. However, as feature sizes get smaller and pattern complexity increases, particular difficulties and a number of material-related issues arise and need to be carefully considered. This review presents a detailed description of these effects and describes reported strategies and achieved SU-8 HAR and 3D structures up to August 2006.
ISSN:0960-1317
1361-6439
DOI:10.1088/0960-1317/17/6/R01