Interfacial reaction between 42Sn-58Bi solder and electroless Ni-P/immersion Au under bump metallurgy during aging : Phase stability, formation and transformation of electronic materials

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Bibliographic Details
Main Authors: MOON GI CHO, KYUNG WOOK PAIK, HYUCK MO LEE, SEONG WOON BOOH, KIM, Tae-Gyu
Format: Conference Proceeding
Language:English
Subjects:
Applied sciences
Cross-disciplinary physics: materials science
rheology
Electronics
Exact sciences and technology
Materials science
Metallization, contacts, interconnects
device isolation
Microelectronic fabrication (materials and surfaces technology)
Physics
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Solid solution hardening, precipitation hardening, and dispersion hardening
aging
Solid solution, precipitation, and dispersion hardening
aging
Treatment of materials and its effects on microstructure and properties
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ISSN:0361-5235
1543-186X