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Structure of the surface microrelief of a droplet evaporating from a rough substrate as a possible cause of contact angle hysteresis
Based on the refraction images of a droplet evaporating on a rough substrate, we simultaneously observed the dynamics of its surface microrelief, contact angle, and contact line deformations along the entire perimeter of the contact line. This has led us conclude that the microrelief structure is di...
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Published in: | Journal of experimental and theoretical physics 2017-04, Vol.124 (4), p.570-579 |
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Main Authors: | , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
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Summary: | Based on the refraction images of a droplet evaporating on a rough substrate, we simultaneously observed the dynamics of its surface microrelief, contact angle, and contact line deformations along the entire perimeter of the contact line. This has led us conclude that the microrelief structure is directly related to the phenomenon of contact angle hysteresis and the jump-like pattern of contact line deformation. We suggest a possible mechanism for the occurrence of contact angle hysteresis during droplet evaporation and derive the relations that specify the range of possible contact angles at known microrelief parameters. |
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ISSN: | 1063-7761 1090-6509 |
DOI: | 10.1134/S1063776117030141 |