CeramicCoated Copper Substrates for Hybrid Circuits

Copper substrates covered with ceramic insulating coating were tested for their ability to be used in thick film technology. The ceramic coating was prepared by screen printing from a dielectric composition containing special glass and aluminium oxide and was fired at 820C1,000C. The electrical prop...

Full description

Saved in:
Bibliographic Details
Published in:Microelectronics international 1984-01, Vol.1 (4), p.4-9
Main Authors: Kuel, R., Broukal, J., Boue, V., Votruba, Z.
Format: Article
Language:English
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:Copper substrates covered with ceramic insulating coating were tested for their ability to be used in thick film technology. The ceramic coating was prepared by screen printing from a dielectric composition containing special glass and aluminium oxide and was fired at 820C1,000C. The electrical properties of the coatings studied included voltage breakdown, surface and bulk insulation resistance and dielectric constant. Resistor compositions designed for use on ceramic substrates were screen printed, as on the substrates mentioned, on alumina or ceramiccoated steel substrates and fired up to the required temperatures 820875C. The resistivity and TCR of the prepared resistors were measured in relation to firing temperature. The distribution of lead, bismuth, ruthenium, barium, palladium, silver and copper in the system resistor or conductor ceramic coatingcopper substrate was investigated. Reference was made to the application of ceramic coatings on copper in other fields, e.g., in heavycurrent electronics.
ISSN:1356-5362
DOI:10.1108/eb044137