Flexible CMOS chip converted by a novel chip transformation process

In this Letter, the authors report a flexible CMOS chip converted by a novel chip transformation process. To realise a truly flexible CMOS chip, a two-step etching process was employed in the transformation process: (i) vapour etching to remove inter-dielectric layers followed by polymer encapsulati...

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Bibliographic Details
Published in:Electronics letters 2020-11, Vol.56 (24), p.1335-1337
Main Authors: Lai, J, Chandrasekaran, S. T, Sanyal, A, Seo, J.-H
Format: Article
Language:English
Subjects:
advanced mobile communication systems
chip transformation process
CMOS integrated circuits
encapsulation
flexible CMOS chip conversion
flexible electronics
foundry‐fabricated CMOS chip
foundry‐processed chips
interdielectric layer removal
plasma etching
polymer encapsulation
polymers
post‐transformation process
rigid chip
Semiconductor technology
sputter etching
two‐step etching process
vapour etching
wearable electronics
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Summary:In this Letter, the authors report a flexible CMOS chip converted by a novel chip transformation process. To realise a truly flexible CMOS chip, a two-step etching process was employed in the transformation process: (i) vapour etching to remove inter-dielectric layers followed by polymer encapsulation and (ii) plasma etching to remove the substrate of the chip. The I–V results measured after the chip transformation process show a voltage variance of
ISSN:0013-5194
1350-911X
1350-911X
DOI:10.1049/el.2020.2235