3-D Compact Marchand Balun Design Based on Through-Silicon via Technology for Monolithic and 3-D Integration

An original concept of 3-D through-silicon via (TSV)-based Marchand baluns and its design methodology is proposed for on- chip and 3-D integration. By utilizing a 3-D packaging process that includes a TSV and redistribution layer (RDL), a meander coupling path is established and embedded in the vert...

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Bibliographic Details
Published in:	IEEE transactions on very large scale integration (VLSI) systems 2022-08, Vol.30 (8), p.1107-1118
Main Authors:	Xiong, Wei, Dong, Gang, Wang, Yang, Zhu, Zhangming, Yang, Yintang
Format:	Article
Language:	eng
Subjects:	3-D integrated circuits (3-D ICs) Baluns Coupling Couplings Design optimization Equivalent circuits Integrated circuits Interconnections Marchand balun Metals monolithic integration redistribution layer (RDL) Substrates through silicon via (TSV) Through-silicon vias Topology Transmission line matrix methods Transmission lines
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Summary:	An original concept of 3-D through-silicon via (TSV)-based Marchand baluns and its design methodology is proposed for on- chip and 3-D integration. By utilizing a 3-D packaging process that includes a TSV and redistribution layer (RDL), a meander coupling path is established and embedded in the vertical direction of the substrate for balun design. The 3-D structure can effectively reduce the on- chip area while maintaining good balance characteristics. Furthermore, the structure can be flexibly integrated with 3-D integrated circuits (3-D ICs) to realize signal conversion between different stacking tiers. An equivalent circuit model based on the TSV-to-TSV coupling channel and coupled transmission line has been established for initial estimation before electromagnetic (EM) optimization. To shorten the design cycle, a specific flow is proposed to meet the structural particularity and different application scenarios. To verify the design method and flow, a design case is analyzed and EM simulated with the antenna feeding network as the target application. The EM simulation results show that the design can work at 43-82 GHz with an amplitude imbalance of less than 0.3 dB and a phase imbalance of less than 1.3°, which meets the requirements of balanced feeding. It only costs a 0.084\,\,\lambda _{\text {g}}\,{\times }\,0.009\,\,\lambda _{\text {g}} footprint, which is far lower than that of the conventional planar types.
ISSN:	1063-8210 1557-9999