Toward a Low Power E-Skin Interface System on a Chip for Taxel Arrays

Electronic skin (e-skin) interface building blocks are presented that are suitable for integration with array-based tactile sensors for prosthetic applications. The first is a low power, low noise capacitive transimpedance amplifier (CTIA) compatible with charge-based polyvinylidene fluoride (PVDF)...

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Bibliographic Details
Main Authors: Murray, Samuel J., Medinger, Joseph, Schmitz, Joseph, Balkir, Sina, Hoffman, Michael W.
Format: Conference Proceeding
Language:English
Subjects:
Hardware
Power demand
Prosthetics
Random access memory
Sensors
System-on-chip
Task analysis
Online Access:Request full text
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Description
Summary:Electronic skin (e-skin) interface building blocks are presented that are suitable for integration with array-based tactile sensors for prosthetic applications. The first is a low power, low noise capacitive transimpedance amplifier (CTIA) compatible with charge-based polyvinylidene fluoride (PVDF) sensors. The second is a high efficiency RISC-V microcontroller unit (MCU) with a custom, on-chip neural processing unit (NPU) to accelerate gesture recognition tasks. Two test chips have been fabricated using a 65 nm CMOS technology: one for the prototype analog front-end (AFE) including the CTIA, and the other for the MCU and NPU. The AFE consumes 112.5 nW per channel, and the MCU consumes 2.83 mW while running the NPU at 112 MHz.
ISSN:2158-1525
2158-1525
DOI:10.1109/ISCAS45731.2020.9180903