Investigation of electrical discontinuity in flip-chip package

In this paper, the discontinuity of a flip-chip (FC) transition between a microstrip line (MS) and a coplanar waveguide (CPW) is modeled and analyzed. The test device is fabricated and measured in comparison with both full-wave and equivalent circuit simulation. The circuit includes more elements an...

Full description

Saved in:
Bibliographic Details
Main Authors: Yanbo Xu, Xiaoli Yang, Yan Li, Panpan Zuo, Hongxing Zheng, Erping Li
Format: Conference Proceeding
Language:English
Subjects:
discontinuity
equivalent circuit
flip-chip
Online Access:Request full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:In this paper, the discontinuity of a flip-chip (FC) transition between a microstrip line (MS) and a coplanar waveguide (CPW) is modeled and analyzed. The test device is fabricated and measured in comparison with both full-wave and equivalent circuit simulation. The circuit includes more elements and is more complex than other types of transitions. The S-parameters of the circuit model have been verified with that of the full-wave simulation, which matches well so that greatly simplifies the design of the complex packages.
ISSN:2151-1233
DOI:10.1109/EDAPS.2017.8276930