SLIM (TM), High Density Wafer Level Fan-Out Package Development with Submicron RDL

A novel HD-FO package platform was introduced with a hybrid RDL structure. An HD-FO package with hybrid RDL could enables higher routing density and multi die construction in a planner configuration. The 1-μm and submicron RDL wafers were fabricated at a foundry and then the essential parts of the i...

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Bibliographic Details
Main Authors: YoungRae Kim, JaeHun Bae, MinHwa Chang, AhRa Jo, Ji Hyun Kim, SangEun Park, Hiner, David, Kelly, Michael, WonChul Do
Format: Conference Proceeding
Language:English
Subjects:
Compounds
die-reconstruction
Fabrication
Filling
high density fan-out package
hybrid RDL
Passivation
POP
Reliability
Routing
Silicon
Online Access:Request full text
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Description
Summary:A novel HD-FO package platform was introduced with a hybrid RDL structure. An HD-FO package with hybrid RDL could enables higher routing density and multi die construction in a planner configuration. The 1-μm and submicron RDL wafers were fabricated at a foundry and then the essential parts of the inorganic RDL were integrated with Amkor's internal organic RDL process making a hybrid structure. Also, the vertical interconnection on a hybrid RDL made 3-dimentional package construction. Key processes including via reveal, top die attach, and vertical package stacking were successfully demonstrated. Technical challenges in HDFO package development was discussed as well as the reliability performance results both in the package and at the board level.
ISSN:2377-5726
DOI:10.1109/ECTC.2017.334