Array antenna integrated fan-out wafer level packaging (InFO-WLP) for millimeter wave system applications

Array antenna integrated with RF chip using InFO-WLP technology is proposed for millimeter wave system applications. Aperture-coupled patch antenna is designed on the fan-out molding compound (MC). The performance of single-element antenna is evaluated first and proved to have 5 dBi of gain. Meanwhi...

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Bibliographic Details
Main Authors: Tsai, Chung-Hao, Hsieh, Jeng-Shien, Liu, Monsen, Yeh, En-Hsiang, Chen, Hsu-Hsien, Hsiao, Ching-Wen, Chen, Chen-Shien, Liu, Chung-Shi, Lii, Mirng-Ji, Wang, Chuei-Tang, Yu, Doug
Format: Conference Proceeding
Language:English
Subjects:
Antenna arrays
Antennas
Arrays
Chips
Feeding
Gain
Integrated circuit interconnections
Millimeter waves
Noise levels
Packages
Radio frequency
Silicon
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Summary:Array antenna integrated with RF chip using InFO-WLP technology is proposed for millimeter wave system applications. Aperture-coupled patch antenna is designed on the fan-out molding compound (MC). The performance of single-element antenna is evaluated first and proved to have 5 dBi of gain. Meanwhile, the interconnect from chip to antenna feeding line is demonstrated to only have 0.7 dB loss, which can save 19 % PA output power compared with that of flip-chip package. Finally, the system performance of 4 × 4 antenna array integrated with RF chip on the InFO structure shows 14.7 dBi of array gain in a small form factor of 10 × 10 × 0.5 mm 3 .
ISSN:0163-1918
2156-017X
DOI:10.1109/IEDM.2013.6724687