Multi-Chip Module Packaging For W-Band Modulator

This letter presents ribbon bond transition of coplanar waveguides (CPWs) between two largely different dielectric constant materials, lithium niobate (LiNbO 3 ) and alumina (Al 2 O 3 ). The design plays an important role in multi-chip module (MCM) integrations of optoelectronic devices on LiNbO 3 f...

Full description

Saved in:
Bibliographic Details
Published in:IEEE microwave and wireless components letters 2011-03, Vol.21 (3), p.145-147
Main Authors: Shireen, Rownak, Shouyuan Shi, Peng Yao, Prather, Dennis W
Format: Article
Language:English
Subjects:
Bonding
Coplanar waveguide (CPW)
Coplanar waveguides
Electrodes
Modulation
Optical waveguides
packaging
ribbon bond
Substrates
Wire
{\rm LiNbO}_{3}
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:This letter presents ribbon bond transition of coplanar waveguides (CPWs) between two largely different dielectric constant materials, lithium niobate (LiNbO 3 ) and alumina (Al 2 O 3 ). The design plays an important role in multi-chip module (MCM) integrations of optoelectronic devices on LiNbO 3 for the applications of millimeter-wave to optical signal processing. The impacts of ribbon bond parameters and CPW dimensions on the transmission characteristics are investigated over 100 GHz bandwidth. Simulated results are confirmed by measurements of the fabricated device.
ISSN:1531-1309
2771-957X
1558-1764
2771-9588
DOI:10.1109/LMWC.2010.2103375