SiC Wirebond Multichip Phase-Leg Module Packaging Design and Testing for Harsh Environment

In order to take full advantage of SiC, a high-temperature wirebond package for multichip phase-leg power module using SiC devices was designed, developed, fabricated, and tested. The details of the material comparison and selection are described, thus culminating a feasible solution for high-temper...

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Bibliographic Details
Published in:IEEE transactions on power electronics 2010-01, Vol.25 (1), p.16-23
Main Authors: Puqi Ning, Rixin Lai, Huff, D., Fei Wang, Ngo, K.D.T., Immanuel, V.D., Karimi, K.J.
Format: Article
Language:English
Subjects:
Applied sciences
Assembly
Design. Technologies. Operation analysis. Testing
Devices
Electrical engineering. Electrical power engineering
Electronic equipment and fabrication. Passive components, printed wiring boards, connectics
Electronics
Exact sciences and technology
High temperature
High-temperature packaging
Integrated circuits
Materials
Materials reliability
Materials testing
Modules
Multichip modules
Packages
Packaging
Packaging design
Power electronics, power supplies
Prototypes
Sealing
Sealing materials
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
SiC devices
Silicon carbide
Temperature
Temperature effects
Thermomechanical processes
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Description
Summary:In order to take full advantage of SiC, a high-temperature wirebond package for multichip phase-leg power module using SiC devices was designed, developed, fabricated, and tested. The details of the material comparison and selection are described, thus culminating a feasible solution for high-temperature operation. A thermal cycling test with large temperature excursion (from -55°C to 250°C) was carried out to evaluate the thermomechanical reliability of the package. During the test, the substrate failed before other parts in 20 cycles. A sealing edge approach was proposed to improve the thermal reliability of the substrate. With the strengthening of the sealing material, the substrate, die-attachment, and wirebond assemblies exhibited satisfactoriness in the thermomechanical reliability tests. In order to evaluate the high-temperature operation ability of designed package, one prototype module was designed and fabricated. The high-temperature continuous power test shows that the package presented in this paper can perform well at 250°C junction temperature.
ISSN:0885-8993
1941-0107
DOI:10.1109/TPEL.2009.2027324