3D Packaging Technology for Integrated Antenna Front-Ends

Thanks to Vertical Multi-Chip Module packaging technology (MCM-V), a novel concept of integrated antenna feed in Ka band has been developed. This technology enables the integration of active elements very close to the radiating surface, which reduces dramatically the weight and volume of the antenna...

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Bibliographic Details
Main Authors: Bonnet, B., Monfraix, P., Chiniard, R., Chaplain, J., Drevon, C., Legay, H., Couderc, P., Cazaux, J.-L.
Format: Conference Proceeding
Language:English
Subjects:
Antenna measurements
Apertures
Dielectrics
Etching
Feeds
Integrated circuit interconnections
Manufacturing
Microwave technology
Packaging
Space technology
Online Access:Request full text
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Summary:Thanks to Vertical Multi-Chip Module packaging technology (MCM-V), a novel concept of integrated antenna feed in Ka band has been developed. This technology enables the integration of active elements very close to the radiating surface, which reduces dramatically the weight and volume of the antenna. In this paper the different technological building blocks are described, and the measurements obtained on the first breadboard are discussed. The promising results obtained should lead to a major breakthrough for active receive antennas, driving down cost and complexity.
DOI:10.1109/EUMC.2008.4751769