Direct Chip Attachment (DCA) Packaging of a 2-D Thermal Flow Sensor

The design and fabrication of a DCA packaged thermal flow sensor, as well as the simulation and test results were presented in this paper. The fabricated flow sensor was glued to the backside of PCB board with the adhesive, and wire bonded to front side of the PCB through a prefabricated hole, and t...

Full description

Saved in:
Bibliographic Details
Main Authors: Guangping Shen, Jian Wu, Hua Zhang, Ming Qin, Qing'an Huang
Format: Conference Proceeding
Language:English
Subjects:
Bonding
Ceramics
Detectors
Fabrication
Packaging
Resins
Temperature sensors
Thermal conductivity
Thermal sensors
Wire
Online Access:Request full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:The design and fabrication of a DCA packaged thermal flow sensor, as well as the simulation and test results were presented in this paper. The fabricated flow sensor was glued to the backside of PCB board with the adhesive, and wire bonded to front side of the PCB through a prefabricated hole, and then the chip was capsulated using thermal insulated resin on the front side. The test results matched well with the predicted value, with an error no more than 8%.
DOI:10.1109/ICEPT.2007.4441487