3D Capacitive Interconnections with Mono- and Bi-Directional Capabilities

A wireless interconnection scheme based on capacitive coupling provides mono- and bi-directional transmission capabilities for 3D system integration. Chips are implemented in 0.13mum CMOS and assembled face-to-face. RX-TX circuits are connected by 8times8mum 2 electrodes and this enables the vertica...

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Bibliographic Details
Main Authors: Fazzi, Alberto, Canegallo, Roberto, Ciccarelli, Luca, Magagni, Luca, Natali, Federico, Jung, Erik, Rolandi, Pier Luigi, Guerrieri, Roberto
Format: Conference Proceeding
Language:English
Subjects:
Bidirectional control
Clocks
Coupling circuits
Delay
Electrodes
Energy consumption
Frequency
Integrated circuit interconnections
Transmitters
Voltage
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Description
Summary:A wireless interconnection scheme based on capacitive coupling provides mono- and bi-directional transmission capabilities for 3D system integration. Chips are implemented in 0.13mum CMOS and assembled face-to-face. RX-TX circuits are connected by 8times8mum 2 electrodes and this enables the vertical propagation of clock at 17GHz, a propagation delay of 420ps for general purpose signals and a throughput of more than 22Mb/s/mum 2 with 0.08pJ/b energy consumption
ISSN:0193-6530
2376-8606
DOI:10.1109/ISSCC.2007.373441