Multilayer RF PCB for space applications: technological and interconnections trade-off

Multilayer RF printed circuits boards with embedded passives are complex structures to manufacture and to package while keeping good RF performances. In this paper, technological solutions aimed at simplifying these issues are proposed: the use of thermoset materials instead of thermoplastic laminat...

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Bibliographic Details
Main Authors: Paillard, M., Bodereau, F., Drevon, C., Monfraix, P., Cazaux, J.L., Bodin, L., Guyon, P.
Format: Conference Proceeding
Language:English
Subjects:
Assembly
Dielectric substrates
Integrated circuit interconnections
Laminates
Manufacturing
Nonhomogeneous media
Packaging machines
Printed circuits
Radio frequency
Space technology
Online Access:Request full text
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Summary:Multilayer RF printed circuits boards with embedded passives are complex structures to manufacture and to package while keeping good RF performances. In this paper, technological solutions aimed at simplifying these issues are proposed: the use of thermoset materials instead of thermoplastic laminates and an original interconnection technique based on "RF openings" machined in the edges of the boards. Two breadboards based on these solutions have been developed and demonstrate very good RF performances between 5 and 15 GHz.
DOI:10.1109/EUMC.2005.1610270