The implementation of ASIC packaging design and manufacturing technologies on high performance networking products

This paper briefly presents how silicon integration and advances in packaging technology have enabled higher performance networking products, and is followed by discussions of how a system-level integrated approach is needed to address the challenges of the next generation products. Different method...

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Bibliographic Details
Main Authors: Camerlo, S., Jie Xue, Wheling Cheng, Duong, R., Shanker, B.J., Yida Zou, Ahmad, M., Brillhart, M., Hubbard, K., Priore, S.
Format: Conference Proceeding
Language:English
Subjects:
Application specific integrated circuits
Assembly
Manufacturing
Packaging
Power system reliability
Product design
Random access memory
Silicon
Thermal management
Thermal stresses
Online Access:Request full text
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Description
Summary:This paper briefly presents how silicon integration and advances in packaging technology have enabled higher performance networking products, and is followed by discussions of how a system-level integrated approach is needed to address the challenges of the next generation products. Different methodologies of integrating memory and ASIC using advanced packaging technologies at both package level and board-/system-level are presented. Both connector-based and SMT based system in package (SiP) solutions with either flip-chip bare-die or BGA technologies are evaluated. Impact of each technology on product designs at silicon, substrate, and board level, as well as the effects on product manufacturability and reliability are discussed.
ISSN:0569-5503
2377-5726
DOI:10.1109/ECTC.2005.1441383