Power Diode Packages with Embedded Microchannel Cooler: Is Further Improvement Possible?

Paper presents results of numerical electro-thermal investigations of a press-pack package with embedded micro channel coolers designed for power diodes. High efficiency of cooling structures allows elimination of external cold plates, but may result in non-uniformities of temperature distribution i...

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Bibliographic Details
Main Authors: Raj, Ewa, Paciello, Salvatore
Format: Conference Proceeding
Language:English
Subjects:
Electronic packaging thermal management
Geometry
microchannel cooler
power diodes
Power engineering
Prototypes
simulations
Temperature distribution
Thermal engineering
Thermal resistance
Online Access:Request full text
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Summary:Paper presents results of numerical electro-thermal investigations of a press-pack package with embedded micro channel coolers designed for power diodes. High efficiency of cooling structures allows elimination of external cold plates, but may result in non-uniformities of temperature distribution in the semiconductor pellet. Investigations on coolers geometry depicted possibilities of further improvement of the novel package. Thermal resistance of 8K/kW can be achieved with temperature difference of 12.5°C in the semiconductor device.
ISSN:2166-9546
DOI:10.1109/CPE-POWERENG60842.2024.10604295