Semi-conductive buffer layer for the conductor-insulator interface of HVDC GIS/GIL

In high voltage direct current (HVDC) gas-insulated switchgear (GIS) and gas-insulated transmission lines (GIL), epoxy resin and its composites serve as the primary insulating components. However, the inherent mismatch in mechanical properties at the interface between the metal conductor and epoxy-b...

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Bibliographic Details
Published in:IEEE transactions on dielectrics and electrical insulation 2024, p.1-1
Main Authors: Liu, Peng, Zhu, Sijia, Xie, Zongliang, Pang, Xi, Xu, Tianlei, Yuan, Hang, Peng, Zongren, Li, He
Format: Article
Language:English
Subjects:
buffer layer
Buffer layers
Coatings
Conductors
Curing
epoxy insulator
HVDC GIS/GIL
HVDC transmission
Insulators
Metals
semi-conductive coating
space charge
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Summary:In high voltage direct current (HVDC) gas-insulated switchgear (GIS) and gas-insulated transmission lines (GIL), epoxy resin and its composites serve as the primary insulating components. However, the inherent mismatch in mechanical properties at the interface between the metal conductor and epoxy-based insulator gives rise to weak points during production and operation, leading to potential issues like physical cracking or electric field distortion. In this work, these challenges are addressed by introducing a semi-conductive buffer layer with rationally modulated electrical and mechanical properties at the conductor/insulator interface. Carbon black nanofillers are incorporated into a polyether-amine cured epoxy matrix for optimal performance. The application of such a buffer layer significantly improves the bonding strength between the epoxy-based insulator and the aluminum conductor, which also effectively inhibits charge injection from metal conductors to GIS/GIL insulators. To ensure industrial applicability, storage modulus, glass transition temperature and coefficient of thermal expansion of the semi-conductive materials are systematically investigated. The design of semi-conductive buffer layer provides a feasible approach to enhancing the mechanical and electrical performance of HVDC GIS/GIL systems.
ISSN:1070-9878
1558-4135
DOI:10.1109/TDEI.2024.3364110