Fabrication of 32x32 2D CMUT arrays on a borosilicate glass substrate with silicon-through-wafer interconnects using anodic bonding process

A 2D transducer array is one of the main components of an ultrasound system with 3D beamforming capability. Using CMUT technology, it is possible to develop complex transducer geometries for different applications. In this work we demonstrate the fabrication of a 32x32-element 2D CMUT array on a gla...

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Bibliographic Details
Main Authors: Annayev, Muhammetgeldi, Biliroglu, Ali Onder, Yamaner, F. Yalcin, Oralkan, Omer
Format: Conference Proceeding
Language:English
Subjects:
2D arrays
anodic bonding process
Bonding processes
Capacitive micromachined ultrasonic transducer (CMUT)
glass substrate
Resonant frequency
silicon-through-glassvias (Si-TGV)
Three-dimensional displays
Ultrasonic imaging
Ultrasonic transducer arrays
Ultrasonic transducers
Ultrasonic variables measurement
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Summary:A 2D transducer array is one of the main components of an ultrasound system with 3D beamforming capability. Using CMUT technology, it is possible to develop complex transducer geometries for different applications. In this work we demonstrate the fabrication of a 32x32-element 2D CMUT array on a glass substrate using silicon through-glass-via interconnects with anodic bonding process. Using silicon vias in a glass substrate improvies the fabrication yield and using anodic bonding process simplifies the fabrication process. Preliminary results show the proposed fabrication process was successful. The resonance frequency of fabricated devices was around 2 MHz in air.
ISSN:1948-5727
DOI:10.1109/IUS51837.2023.10307534