Isothermal em as highly accelerated test method for copper damascene lines

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Bibliographic Details
Main Authors: Kin Leong, Yap Andrew, Bee Hoon Lim, Eng Chye Chua, Yeow Kheng Lim, Suat Cheng, Khoo Sherry
Format: Conference Proceeding
Language:English
Subjects:
Circuit testing
Copper
Electromigration
Integrated circuit interconnections
Isothermal processes
Life estimation
Packaging
Semiconductor device testing
Temperature
Thermal stresses
Online Access:Request full text
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DOI:10.1109/IPFA.2002.1025631