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Horizontal Current Bipolar Transistor DC Performance at Cryogenic Temperatures
The DC current gain (β) of Si bipolar junction transistors (BJTs) reported so far decreases at cryogenic temperatures (CT), or shows a very limited improvement at best. For temperatures above 90 K, the Horizontal Current Bipolar Transistor (HCBT) behaves comparably to other published Si BJTs. Howeve...
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Published in: | IEEE electron device letters 2023-10, Vol.44 (10), p.1-1 |
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Main Authors: | , , , , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
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Summary: | The DC current gain (β) of Si bipolar junction transistors (BJTs) reported so far decreases at cryogenic temperatures (CT), or shows a very limited improvement at best. For temperatures above 90 K, the Horizontal Current Bipolar Transistor (HCBT) behaves comparably to other published Si BJTs. However, cryogenic measurements of HCBT devices show a steep β increase at temperatures below 90 K. We report a current gain of 85 at 300 K, a minimum β of 31 at 90 K and an increase of β to 66 at 17 K. The collector-emitter breakdown voltage ( BV CEO ) measured around the peak β varies only within 0.2 V over the examined temperature range. Additionally, the Early voltage ( V A ) increases for temperatures below 50 K, improving the β V A product at 20 K by 2.2x as compared to 300 K, which makes the HCBT a potentially attractive technology for deep cryogenic applications. TCAD simulations of an equivalent Si BJT structure show that such considerable increase of β at CT can be attributed to the interplay between incomplete ionization (II) of acceptors in the base and bandgap narrowing (BGN) in the emitter in a specific range of HCBT doping profiles. |
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ISSN: | 0741-3106 1558-0563 |
DOI: | 10.1109/LED.2023.3309700 |