Low Computational Cost Thermal Modelling of High-Frequency Power Transformers using an Admittance Matrix Apporach

Thermal modelling of magnetic components in high-frequency power electronic systems is not trivial. This can be attributed to the complex non-uniform losses, heterogenous construction of magnetic components, and the temperature dependence of electrical and magnetic properties. Accurate thermal model...

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Bibliographic Details
Main Authors: Dey, Anshuman, Shafiei, Navid, Khandekhar, Rahul, Eberle, Wilson, Li, Ri
Format: Conference Proceeding
Language:English
Subjects:
Bidirectional control
Compact Thermal Modelling
Computational efficiency
Computational modeling
formatting
insert
Magnetic flux
Numerical models
Power electronics
style
styling
Thermomechanical processes
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Summary:Thermal modelling of magnetic components in high-frequency power electronic systems is not trivial. This can be attributed to the complex non-uniform losses, heterogenous construction of magnetic components, and the temperature dependence of electrical and magnetic properties. Accurate thermal modelling of such magnetic components relies on the use of bi-directionally coupled electromagnetic-thermal numerical analysis. Although such bi-directionally coupled numerical models provide accurate results, the computational cost of such models can be restrictive. Hence, there is a need for low computational cost thermal models of magnetic components. In this paper, we develop a low computational cost thermal model of a power transformer using the admittance matrix approach. First, a bi-directionally coupled multiphysics model of a power transformer is developed and validated using experimental test results. Using the numerical model, low-cost thermal models are evaluated for surface heat transfer coefficients varying between 1 to \mathbf{200}\ \boldsymbol{W}/\boldsymbol{m}^{\mathbf{2}}\cdot \boldsymbol{K} , covering the typical thermal operating range of magnetic components housed in conventional power electronic systems. The final low-cost thermal model's surface temperature and heat flux predictions were within \pm \mathbf{8}.\mathbf{2}\% of the numerical results, while the junction temperature error was \pm \mathbf{6}.\mathbf{18}\ \% . The simplified thermal model developed shows close to Boundary Condition Independence (BCI) behaviour and is a low computational cost alternative to the numerical model.
ISSN:2694-2135
DOI:10.1109/ITherm55368.2023.10177609