High-tolerance thin-film solder joints for electrical interconnection in harsh environments

This paper presents a pioneering use of thin-film solder joint in the electrical interconnection of high-temperature thin-film sensors, which aims to improve the low tolerance of traditional soldered balls in extreme environments. The structure of the thin-film solder joint, composed of silver foil,...

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Bibliographic Details
Published in:IEEE sensors journal 2023-06, Vol.23 (11), p.1-1
Main Authors: Wu, Chao, Fu, Yanzhang, Pan, Xiaochuan, Zeng, Yingjun, Chen, Guochun, Lin, Fan, Chen, Qinnan, Sun, Daoheng, Hai, Zhenyin
Format: Article
Language:English
Subjects:
Coupling
Drop/vibration
Extreme environments
Failure performance
Failure rates
High temperature
High-temperature thin-film sensor
Joining
Metal foils
Optical imaging
Optical sensors
Reliability
Scanning electron microscopy
Silver
Soldered joints
Soldering
Solders
Strain gauges
Stress
Substrates
Thermal shock
Thermal stability
Thin films
Thin-film solder joint
Thin-film strain gauge
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Summary:This paper presents a pioneering use of thin-film solder joint in the electrical interconnection of high-temperature thin-film sensors, which aims to improve the low tolerance of traditional soldered balls in extreme environments. The structure of the thin-film solder joint, composed of silver foil, solder joint paste, and metal wire, has a negligible mass compared to traditional soldered balls. As a result, the inertia force on the solder joint/substrate interface during vibration and force impact is greatly reduced, improving the reliability of the solder joint under thermal-mechanical coupling impacts. The thin-film solder joint has been verified using both metal (AgPd paste) and ceramic (TiB2/SiCNO paste) solders, and can withstand extreme environments such as thermal shock and high "g" loading. The designed thin-film solder joint can withstand impact energy of up to 3 J at 1000 °C without failure, which is 6 times higher than that of traditional soldered balls (with a statistical failure rate of up to 67% under 0.5 J impact). The thin-film solder joint was successfully used for electrical interconnection of high-temperature thin-film strain gauges, demonstrating excellent reliability under thermal-mechanical coupling impacts at 1000 °C. Our high-tolerance thin-film solder joints show promising potential for use in electrical interconnection in harsh environments.
ISSN:1530-437X
1558-1748
DOI:10.1109/JSEN.2023.3268298