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Thermoelectric properties improvement in Mg2Sn thin films by structural modification
Mg-Sn thin films (21 ≤ at. % Sn ≤ 42.5) were deposited by magnetron sputtering in the argon atmosphere. The structure and morphology of the films were characterized as a function of the composition. Mg2Sn structure was changed from stable face-centered cubic to metastable orthorhombic structure whil...
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Published in: | Journal of alloys and compounds 2019-08, Vol.797, p.1078-1085 |
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Main Authors: | , , , , , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
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Summary: | Mg-Sn thin films (21 ≤ at. % Sn ≤ 42.5) were deposited by magnetron sputtering in the argon atmosphere. The structure and morphology of the films were characterized as a function of the composition. Mg2Sn structure was changed from stable face-centered cubic to metastable orthorhombic structure while the content of Sn in the films increased. The influence of this structural modification on thermoelectric properties was discussed in a wide range of temperatures (30–200 °C). The film carrier concentration and mobility were measured to explain the electronic transport behavior as a function of the film structural modifications. The maximum figure of merit ZT ≈ 0.26 at 200 °C was reached for the film with 36 at. % Sn while a mixture of cubic and orthorhombic Mg2Sn structures coexisted. An annealing treatment was performed under vacuum (∼10−4 Pa) at different temperatures (up to 600 °C) to determine the limit of structural and morphological stability of this film.
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•P-type Mg-Sn thin films (21 ≤ at. % Sn ≤ 42.5) were deposited by sputtering.•Mg2Sn face-centered cubic structure changed to orthorhombic by Sn content rising.•The influence of structural modification on thermoelectric properties was studied.•ZT ≈ 0.26 was reached at 200 °C as cubic and orthorhombic Mg2Sn structures coexisted.•Mg2Sn structure was stable until 500 °C and decomposed to Mg and Sn at T > 500 °C. |
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ISSN: | 0925-8388 1873-4669 |
DOI: | 10.1016/j.jallcom.2019.05.214 |