Effects of salt spray test on lead-free solder alloy

This paper starts with a bibliographic survey about solder corrosion and experimental results of the corrosion on lead-free solder balls during salt spray tests. Focus is made on the SnAgCu solder alloy. Ball Grid Array assemblies and “Package on Package” components were put up to 96h in a salt spra...

Full description

Saved in:
Bibliographic Details
Published in:Microelectronics and reliability 2016-09, Vol.64, p.242-247
Main Authors: Guédon-Gracia, A., Frémont, H., Plano, B., Delétage, J.-Y., Weide-Zaage, K.
Format: Article
Language:English
Subjects:
Corrosion
Electronic assembly
Engineering Sciences
Micro and nanotechnologies
Microelectronics
Solder joints
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:This paper starts with a bibliographic survey about solder corrosion and experimental results of the corrosion on lead-free solder balls during salt spray tests. Focus is made on the SnAgCu solder alloy. Ball Grid Array assemblies and “Package on Package” components were put up to 96h in a salt spray chamber at 35°C with 5% sodium chloride (NaCl) aqua according to the ASTM B117-09 standard. The weight is measured during the test. The solder alloys are observed and analysed along the ageing with optical microscope and scanning electron microscope equipped with an energy-dispersive x-ray system. The solder alloy deterioration is visible after 48h. The microstructure is analysed in order to determine the corroded residues found on the surface solder balls after the salt spray test. Tin oxychloride (Sn(OH)Cl) is found on BGA solder joints after reflow and on PoP solder balls before reflow. The size of the solder balls has an influence on the corrosion state. Finally a method is developed in order to measure the corrosion product growth on the same sample during the salt environment exposure. •Study of corrosion on lead-free solder balls during salt spray tests•SnAgCu solder alloys analysed along the ageing.•Tin oxychloride (Sn(OH)Cl) detected as major corrosion product.•The size of the solder balls has an influence on the corrosion state.
ISSN:0026-2714
1872-941X
DOI:10.1016/j.microrel.2016.07.034