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Measurement of the Height of Nanorelief Elements by the Method of Three-Dimensional Reconstruction in a Scanning Electron Microscope

Comparative measurements of the height of the nanorelief steps of the surface of a silicon wafer by methods of three-dimensional reconstruction using a scanning electron microscope and profilometry were carried out. To realize the method of three-dimensional reconstruction, an islet gold film is for...

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Bibliographic Details
Published in:Measurement techniques 2017-06, Vol.60 (3), p.220-225
Main Authors: Darznek, S. A., Karabanov, D. A., Kuzin, A. Yu, Mityukhlyaev, V. B., Todua, P. A., Filippov, M. N.
Format: Article
Language:English
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Summary:Comparative measurements of the height of the nanorelief steps of the surface of a silicon wafer by methods of three-dimensional reconstruction using a scanning electron microscope and profilometry were carried out. To realize the method of three-dimensional reconstruction, an islet gold film is formed on the surface of the test sample. The AlphaStep D-600 profiler is calibrated with a KTS-4500 QS step height gauge. The coincidence of the results of measurements with the methods of three-dimensional reconstruction and profilometry is established. The possibilities of reducing the uncertainty of the measurement results by the method of three-dimensional reconstruction were analyzed.
ISSN:0543-1972
1573-8906
DOI:10.1007/s11018-017-1177-4