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Sintered Ag nanoparticle ink achieves 50% higher conductivity than bulk Ag in interconnections by doping with In
Nanoimprint lithography has been used to fabricate micro/nano devices and has drawn widespread attention owing to its features of large scale, high resolution and low cost. Devices manufactured by nanoimprint are desired for their higher conductivity, especially in their interconnecting wires. In th...
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Published in: | Applied physics express 2019-05, Vol.12 (5), p.55004 |
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container_title | Applied physics express |
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creator | Li, Qiuen Li, Mengke Jia, Bin Shangguan, Lei Ma, Liuhong Zhong, Yinghui Su, Yufeng Duan, Zhiyong |
description | Nanoimprint lithography has been used to fabricate micro/nano devices and has drawn widespread attention owing to its features of large scale, high resolution and low cost. Devices manufactured by nanoimprint are desired for their higher conductivity, especially in their interconnecting wires. In this paper, In nanoparticles were doped onto Ag nanoparticles to improve their properties. The optimum doping ratio was determined under our experimental conditions. Interconnecting wires which consisted of a mixture of particles achieved a 50% higher conductivity than bulk Ag sintered in N2 at 200 °C. The effect of In doping on the microstructure of interconnections was also investigated. |
doi_str_mv | 10.7567/1882-0786/ab102e |
format | article |
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Phys. Express</addtitle><description>Nanoimprint lithography has been used to fabricate micro/nano devices and has drawn widespread attention owing to its features of large scale, high resolution and low cost. Devices manufactured by nanoimprint are desired for their higher conductivity, especially in their interconnecting wires. In this paper, In nanoparticles were doped onto Ag nanoparticles to improve their properties. The optimum doping ratio was determined under our experimental conditions. Interconnecting wires which consisted of a mixture of particles achieved a 50% higher conductivity than bulk Ag sintered in N2 at 200 °C. The effect of In doping on the microstructure of interconnections was also investigated.</description><subject>Ag interconnection</subject><subject>Conductivity of nanoparticle wires</subject><subject>In doping</subject><subject>Nanoimprint</subject><subject>Sintering</subject><issn>1882-0778</issn><issn>1882-0786</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2019</creationdate><recordtype>article</recordtype><recordid>eNp1kL1PwzAQxS0EEqWwM3pBYiD0nMSOO1YVH5UqMQCz5diXxm1xIict5L8noagTDKf70HtPpx8h1wzuMy6yCZMyjiCTYqJzBjGekNHxdHqcM3lOLppmDSDShIkRqV-dbzGgpbMV9dpXtQ6tM1ukzm-oNqXDPTaUww0t3arEQE3l7c60bu_ajral9jTfbTeD3Xn6E9YrPPaKyjc076itaudX9NO1JV34S3JW6G2DV799TN4fH97mz9Hy5Wkxny0jk7CkjThLJWQaCmmAFywGy1KDVk9zoU2_CZOLGGIupUWUaR6jFjbHtC8zNTJJxgQOuSZUTROwUHVwHzp0ioEaiKkBiRrwqAOx3nJ7sLiqVutqF3z_oNI1fikWK66Ac4BU1bbopXd_SP9N_gZvqHxr</recordid><startdate>20190501</startdate><enddate>20190501</enddate><creator>Li, Qiuen</creator><creator>Li, Mengke</creator><creator>Jia, Bin</creator><creator>Shangguan, Lei</creator><creator>Ma, Liuhong</creator><creator>Zhong, Yinghui</creator><creator>Su, Yufeng</creator><creator>Duan, Zhiyong</creator><general>IOP Publishing</general><scope>AAYXX</scope><scope>CITATION</scope><orcidid>https://orcid.org/0000-0002-8059-3090</orcidid></search><sort><creationdate>20190501</creationdate><title>Sintered Ag nanoparticle ink achieves 50% higher conductivity than bulk Ag in interconnections by doping with In</title><author>Li, Qiuen ; Li, Mengke ; Jia, Bin ; Shangguan, Lei ; Ma, Liuhong ; Zhong, Yinghui ; Su, Yufeng ; Duan, Zhiyong</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c313t-514807a0f8c05f120d14ceda9b6ac20d6cb6202588dee84b2ea6dbe4dbec9c833</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2019</creationdate><topic>Ag interconnection</topic><topic>Conductivity of nanoparticle wires</topic><topic>In doping</topic><topic>Nanoimprint</topic><topic>Sintering</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Li, Qiuen</creatorcontrib><creatorcontrib>Li, Mengke</creatorcontrib><creatorcontrib>Jia, Bin</creatorcontrib><creatorcontrib>Shangguan, Lei</creatorcontrib><creatorcontrib>Ma, Liuhong</creatorcontrib><creatorcontrib>Zhong, Yinghui</creatorcontrib><creatorcontrib>Su, Yufeng</creatorcontrib><creatorcontrib>Duan, Zhiyong</creatorcontrib><collection>CrossRef</collection><jtitle>Applied physics express</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Li, Qiuen</au><au>Li, Mengke</au><au>Jia, Bin</au><au>Shangguan, Lei</au><au>Ma, Liuhong</au><au>Zhong, Yinghui</au><au>Su, Yufeng</au><au>Duan, Zhiyong</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Sintered Ag nanoparticle ink achieves 50% higher conductivity than bulk Ag in interconnections by doping with In</atitle><jtitle>Applied physics express</jtitle><addtitle>Appl. 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source | IOPscience journals; Institute of Physics:Jisc Collections:IOP Publishing Read and Publish 2024-2025 (Reading List) |
subjects | Ag interconnection Conductivity of nanoparticle wires In doping Nanoimprint Sintering |
title | Sintered Ag nanoparticle ink achieves 50% higher conductivity than bulk Ag in interconnections by doping with In |
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