Sintered Ag nanoparticle ink achieves 50% higher conductivity than bulk Ag in interconnections by doping with In

Nanoimprint lithography has been used to fabricate micro/nano devices and has drawn widespread attention owing to its features of large scale, high resolution and low cost. Devices manufactured by nanoimprint are desired for their higher conductivity, especially in their interconnecting wires. In th...

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Bibliographic Details
Published in:Applied physics express 2019-05, Vol.12 (5), p.55004
Main Authors: Li, Qiuen, Li, Mengke, Jia, Bin, Shangguan, Lei, Ma, Liuhong, Zhong, Yinghui, Su, Yufeng, Duan, Zhiyong
Format: Article
Language:English
Subjects:
Ag interconnection
Conductivity of nanoparticle wires
In doping
Nanoimprint
Sintering
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Summary:Nanoimprint lithography has been used to fabricate micro/nano devices and has drawn widespread attention owing to its features of large scale, high resolution and low cost. Devices manufactured by nanoimprint are desired for their higher conductivity, especially in their interconnecting wires. In this paper, In nanoparticles were doped onto Ag nanoparticles to improve their properties. The optimum doping ratio was determined under our experimental conditions. Interconnecting wires which consisted of a mixture of particles achieved a 50% higher conductivity than bulk Ag sintered in N2 at 200 °C. The effect of In doping on the microstructure of interconnections was also investigated.
ISSN:1882-0778
1882-0786
DOI:10.7567/1882-0786/ab102e