(Invited) In Situ XPS Study on ALD (Atomic Layer Deposition) of High-k Dielectrics: La 2 O 3 Using La-Formidinate and Ozone

The detailed growth behavior of lanthanum oxide (La2O3) on a silicon substrate during atomic layer deposition (ALD) is investigated by in-situ, x-ray photoelectron spectroscopy (XPS) following individual ALD pulses of tris(N,N'-diisopropyl-formamidinato) lanthanum [La(iPrfAMD)3] and highly conc...

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Bibliographic Details
Published in:ECS transactions 2012-04, Vol.45 (3), p.95-101
Main Authors: Kim, Jiyoung, Kim, Hyun-Chul, Wallace, Robert M., Park, TaeJoo
Format: Article
Language:English
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Summary:The detailed growth behavior of lanthanum oxide (La2O3) on a silicon substrate during atomic layer deposition (ALD) is investigated by in-situ, x-ray photoelectron spectroscopy (XPS) following individual ALD pulses of tris(N,N'-diisopropyl-formamidinato) lanthanum [La(iPrfAMD)3] and highly concentrated ozone (~390 g/m3). At the initial growth stage, ozone oxidized the La-ligand as well as the silicon substrate. During oxidation of silicon substrate, a noticeable amount of silicon atoms diffused into growing La2O3 film, resulting in Si-rich and La-rich La-silicates showing composition gradient of La/Si at the deposition temperature of 250 oC. The amount of La-silicate after third ALD cycle reached more than 50 % of that generated by 30 cycles. As the thickness of the film increased with sequential ALD cycles, the substrate oxidation as well as the out-diffusion of Si atoms becomes a negligible quantity, and the pure La2O3 film starts growing leaving La-silicate layers at the interface.
ISSN:1938-5862
1938-6737
DOI:10.1149/1.3700876