A Study on the Bonding Process of Cu Bump/Sn/Cu Bump Bonding Structure for 3D Packaging Applications

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Bibliographic Details
Published in:Journal of the Electrochemical Society 2010, Vol.157 (4), p.H420
Main Authors: Lee, Byunghoon, Park, Jongseo, Jeon, Seong-jae, Kwon, Kee-won, Lee, Hoo-jeong
Format: Article
Language:English
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ISSN:0013-4651
DOI:10.1149/1.3301931