Microstructural Study of the Effect of Chloride Ion on Electroplating of Copper in Cupric Sulfate-Sulfuric Acid Bath

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Bibliographic Details
Published in:Journal of the Electrochemical Society 2005, Vol.152 (9), p.C605
Main Authors: Kao, Y. L., Li, K. C., Tu, G. C., Huang, C. A.
Format: Article
Language:English
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ISSN:0013-4651
DOI:10.1149/1.1984352