Single Wafer Furnace and Its Thermal Processing Applications

A resistively heated, vacuum and atmospheric pressure compatible, single wafer furnace (SWF) system is proposed to improve operational flexibility of conventional furnaces and productivity of single wafer rapid thermal processing (RTP) systems. The design concept and hardware configuration of the SW...

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Bibliographic Details
Published in:Japanese Journal of Applied Physics 2000-07, Vol.39 (7A), p.L694
Main Authors: Yoo, Woo Sik, Fukada, Takashi, Kuribayashi, Hiromitsu, Kitayama, Hirofumi, Takahashi, Nobuaki, Enjoji, Keiichi, Sunohara, Kiyoshi
Format: Article
Language:English
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Summary:A resistively heated, vacuum and atmospheric pressure compatible, single wafer furnace (SWF) system is proposed to improve operational flexibility of conventional furnaces and productivity of single wafer rapid thermal processing (RTP) systems. The design concept and hardware configuration of the SWF system are described. The temperature measurement/control techniques and thermal characteristics of the SWF system are described. Typical process results in TiSi formation, implant anneal and thin oxide formation using the SWF system are reported. Due to the vertically stacked, dual chamber configuration and steady state temperature control, very flexible operation with a high throughput at a minimal power consumption (
ISSN:0021-4922
1347-4065
DOI:10.1143/JJAP.39.L694