New Three-Dimensional Wafer Bonding Technology Using the Adhesive Injection Method

A new three-dimensional (3D) wafer bonding technology using the adhesive injection method has been proposed, in order to realize a real-time micro-vision system and a real shared memory. Several key technologies for 3D LSI, such as deep trench formation for buried interconnection, wafer grinding and...

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Bibliographic Details
Published in:Japanese Journal of Applied Physics 1998-03, Vol.37 (3S), p.1217
Main Authors: Takuji Matsumoto, Takuji Matsumoto, Masakazu Satoh, Masakazu Satoh, Katsuyuki Sakuma, Katsuyuki Sakuma, Hiroyuki Kurino, Hiroyuki Kurino, Nobuaki Miyakawa, Nobuaki Miyakawa, Hikotaro Itani, Hikotaro Itani, Mitsumasa Koyanagi, Mitsumasa Koyanagi
Format: Article
Language:English
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Summary:A new three-dimensional (3D) wafer bonding technology using the adhesive injection method has been proposed, in order to realize a real-time micro-vision system and a real shared memory. Several key technologies for 3D LSI, such as deep trench formation for buried interconnection, wafer grinding and chemical-mechanical polishing, wafer alignment and wafer bonding using the adhesive injection method, have been developed.
ISSN:0021-4922
1347-4065
DOI:10.1143/JJAP.37.1217