Measurement of Silicon Micromachined Waveguide Components at 500-750 GHz

This paper presents techniques used to assemble and measure micromachined submillimeter-wave waveguide circuits operating from 500 to 750 GHz. A novel micromechanical compression pin is developed to improve wafer-to-wafer alignment to less than 1 μm. Connection between the silicon waveguide and the...

Full description

Saved in:
Bibliographic Details
Published in:IEEE transactions on terahertz science and technology 2014-01, Vol.4 (1), p.33-38
Main Authors: Reck, Theodore J., Jung-Kubiak, Cecile, Gill, John, Chattopadhyay, Goutam
Format: Article
Language:English
Subjects:
Couplers
Loss measurement
Metals
Pins
Rectangular waveguide
Silicon
silicon micromachining
submillimeter-wave
terahertz (THz) frequencies
Waveguide components
Waveguide discontinuities
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:This paper presents techniques used to assemble and measure micromachined submillimeter-wave waveguide circuits operating from 500 to 750 GHz. A novel micromechanical compression pin is developed to improve wafer-to-wafer alignment to less than 1 μm. Connection between the silicon waveguide and the VNA is aligned through a silicon boss that inserts into the custom waveguide flange. Waveguide loss is characterized for both E- and H-plane split waveguides and is found to be similar to standard metal waveguides. Finally, measurement of a 3 dB hybrid coupler operating from 500 to 600 GHz is presented.
ISSN:2156-342X
2156-3446
DOI:10.1109/TTHZ.2013.2282534