A new approach to designing electronic systems for operation in extreme environments: Part I - The SiGe Remote Sensor Interface

We have described the modeling, circuit design, system integration, and measurement of a Remote Sensor Interface (Figure 20) that took place over a span of 5 years and 8 fabrication cycles. It was conceived as part of the Multi-Chip Module (MCM) shown in Figure 21, which also includes a digital cont...

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Bibliographic Details
Published in:IEEE aerospace and electronic systems magazine 2012-06, Vol.27 (6), p.25-34
Main Authors: Diestelhorst, R. M., England, T. D., Berger, R., Garbos, R., Ulaganathan, C., Blalock, B., Cornett, K., Mantooth, A., Xueyang Geng, Dai, F., Johnson, W., Holmes, J., Alles, M., Reed, R., McCluskey, P., Mojarradi, M., Peltz, L., Frampton, R., Eckert, C., Cressler, J. D.
Format: Magazinearticle
Language:English
Subjects:
Aircraft components
Circuit design
CIrcuit layout
Computer architecture
Design methodology
Digital
Digital control
Electronic systems
Environmental factors
Integrated circuits
Mathematical models
Microprocessors
NASA
Programming
Radar remote sensing
Remote sensing
Remote sensors
Silicon germanides
Space missions
Space vehicles
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Summary:We have described the modeling, circuit design, system integration, and measurement of a Remote Sensor Interface (Figure 20) that took place over a span of 5 years and 8 fabrication cycles. It was conceived as part of the Multi-Chip Module (MCM) shown in Figure 21, which also includes a digital control chip for clocking, programming, and read-out. Further work beyond the scope of this was performed to validate the RSI for the extreme environmental conditions of a lunar mission, and individual blocks are presently.
ISSN:0885-8985
1557-959X
DOI:10.1109/MAES.2012.6328550