Half-Mode Buried Corrugated Substrate Integrated Waveguide

A half-mode buried corrugated substrate-integrated waveguide is proposed. Its dominant mode propagation behavior is almost identical to that of the half-mode substrate-integrated waveguide but offers a floating top conductor thereby permitting active devices connected to its longitudinal open-edge t...

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Bibliographic Details
Published in:IEEE microwave and wireless components letters 2014-04, Vol.24 (4), p.215-217
Main Author: Eccleston, Kimberley W.
Format: Article
Language:English
Subjects:
Applied sciences
Bandwidth
Circuit properties
Corrugating
Cut-off
Cutoff frequency
Design engineering
Dielectrics
Electric coils
Electric, optical and optoelectronic circuits
Electronics
Exact sciences and technology
Impedance
Magnetic devices
Metals
Microstrip
Microwave circuits, microwave integrated circuits, microwave transmission lines, submillimeter wave circuits
Microwaves
Periodic structures
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
substrate integrated waveguide (SIW)
Substrates
transverse electric modes
Walls
Wave propagation
Waveguides
Wireless communication
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Summary:A half-mode buried corrugated substrate-integrated waveguide is proposed. Its dominant mode propagation behavior is almost identical to that of the half-mode substrate-integrated waveguide but offers a floating top conductor thereby permitting active devices connected to its longitudinal open-edge to be biased without the need for extra biasing chokes. The corrugations comprise open-circuit stubs buried in the substrate that are connected to the top wall of the waveguide by vias. These stubs are quarter-wave in length at a frequency twice the dominant mode cut-off frequency. The corrugations and vias are used to obtain an electric wall. Burying stubs in the substrate results in a low stub input impedance over a wide bandwidth which allows a monomode bandwidth of 3:1 to be obtained. Experiments for waveguides with a TE0.5,0 mode cut-off frequency of 2.8 GHz demonstrate its effectiveness.
ISSN:1531-1309
2771-957X
1558-1764
2771-9588
DOI:10.1109/LMWC.2013.2293660